• 1
• MD16R162GEG0-CT9
• Samsung Semiconductor, Inc.
• (16M x 16) * 16 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 2
• MD16R162GEG0-CN1
• Samsung Semiconductor, Inc.
• (16M x 16) * 16 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 3
• MD16R162GEG0-CM8
• Samsung Semiconductor, Inc.
• (16M x 16) * 16 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 4
• MD16R162GDF0-CT9
• Samsung Semiconductor, Inc.
• (16M x 16) * 16 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 5
• MD16R162GDF0-CN9
• Samsung Semiconductor, Inc.
• (16M x 16) * 16 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 6
• MD16R162GDF0-CN1
• Samsung Semiconductor, Inc.
• 32 Bit RIMM Module
• 16页
• 184K

• 7
• MD16R162GDF0-CM9
• Samsung Semiconductor, Inc.
• (16M x 16) * 16 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 8
• MD16R162GDF0-CM8
• Samsung Semiconductor, Inc.
• (16M x 16) * 16 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 9
• MD16R162GDF0-CK8
• Samsung Semiconductor, Inc.
• (16M x 16) * 16 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 10
• MD16R1628EG0-CT9
• Samsung Semiconductor, Inc.
• (16M x 16) * 8 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 11
• MD16R1628EG0-CN1
• Samsung Semiconductor, Inc.
• (16M x 16) * 8 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 12
• MD16R1628EG0-CM8
• Samsung Semiconductor, Inc.
• (16M x 16) * 8 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 13
• MD16R1628DF0-CT9
• Samsung Semiconductor, Inc.
• (16M x 16) * 8 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 14
• MD16R1628DF0-CN9
• Samsung Semiconductor, Inc.
• (16M x 16) * 8 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 15
• MD16R1628DF0-CN1
• Samsung Semiconductor, Inc.
• 32 Bit RIMM Module
• 16页
• 184K

• 16
• MD16R1628DF0-CM9
• Samsung Semiconductor, Inc.
• (16M x 16) * 8 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 17
• MD16R1628DF0-CM8
• Samsung Semiconductor, Inc.
• (16M x 16) * 8 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 18
• MD16R1628DF0-CK8
• Samsung Semiconductor, Inc.
• (16M x 16) * 8 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 19
• MD16R1624EG0-CT9
• Samsung Semiconductor, Inc.
• (16M x 16) * 4 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 20
• MD16R1624EG0-CN1
• Samsung Semiconductor, Inc.
• (16M x 16) * 4 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 21
• MD16R1624EG0-CM8
• Samsung Semiconductor, Inc.
• (16M x 16) * 4 pcs 32 Bit RIMM Module Based on 256 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 254K

• 22
• MD16R1624DF0-CT9
• Samsung Semiconductor, Inc.
• (16M x 16) * 4 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 23
• MD16R1624DF0-CN9
• Samsung Semiconductor, Inc.
• (16M x 16) * 4 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 24
• MD16R1624DF0-CN1
• Samsung Semiconductor, Inc.
• 32 Bit RIMM Module
• 16页
• 184K

• 25
• MD16R1624DF0-CM9
• Samsung Semiconductor, Inc.
• (16M x 16) * 4 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 26
• MD16R1624DF0-CM8
• Samsung Semiconductor, Inc.
• (16M x 16) * 4 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 27
• MD16R1624DF0-CK8
• Samsung Semiconductor, Inc.
• (16M x 16) * 4 pcs 32 Bit RIMM Module Based on 256 MBit D-die, 32s Banks, 16k/32 ms Ref, 2.5 V
• 16页
• 255K

• 28
• MD1620F
• Shindengen America, Inc. (SAI)
• 5V Stepping Down DC to DC Converter Power IC
• 4页
• 427K

• 29
• MD1620F
• Shindengen America, Inc. (SAI)
• 5V Stepping Down DC to DC Converter Power IC
• 20页
• 1025K

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